Multi-chip Module Packaging for Power Applications
Introduce the various aspects of Integrated Circuit Packaging to the students. This includes floor planning, sample preparation, die attachment, wire bonding and encapsulation, etc. The students will have hands on experience in performing various assembly and testing procedures.
The students are expected to be able to produce a power transistor module.
Time commitment
4 hours per week
Some knowledge in semiconductor devices will be helpful.
Positions available
2 positions available
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